30 Sep,2024
New mixed welding process
1Selective welding
In selective soldering, only certain areas are exposed to the solder wave. Since the PCB itself is a poor heat transfer medium, it will not heat and melt the solder joints adjacent to the components and PCB areas during soldering.
Flux must also be pre-coated before soldering. The flux is only applied to the lower part of the PCB to be soldered, but selective soldering is not suitable for soldering chip components.
2Dip soldering process
Using the immersion selective welding process, solder joints of 0.7mm to 10mm can be welded. The welding process of short leads and small-sized pads is more stable and has less possibility of bridging. The distance between the edges of adjacent solder joints, devices and soldering tips should be Greater than 5mm.
3Through-holeReflow,THR
THR，It uses reflow soldering technology to assemble through-hole components and special-shaped components.
As products increasingly focus on miniaturization, increased functionality, and higher component density, many single- and double-sided panels are dominated by surface mount components.
However, due to factors such as inherent strength, reliability and applicability, through-hole devices are still superior to SMC in some cases, especially connectors at the edge of the PCB.
The disadvantage of using through-hole devices on circuit boards dominated by surface-mount components is that the cost of a single solder joint is high. The key to this type of assembly is the ability to provide both through-hole and surface-mount components in a single integrated process. Provides simultaneous reflow soldering.
Relevant News
